Thermal Analysis for High-Power Pulsed RF Applications
Cadence Design Systems Cadence Design Systems
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 Published On Sep 19, 2024

Watch this circuit envelope simulation demonstration which uses Cadence Microwave Office software and Cadence Celsius Thermal Solver to analyze the temperature across a multi-fingered FET transistor operating under pulsed RF operating conditions. This allows designers to ensure their device is not at risk of failure due to overheating or that output power is not being sacrificed for excessive thermal margins.

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